FLUX FOR DIFFICULT SOLDERING RT-9

RT‑9 Flux Paste 10 g is a high-performance no‑clean soldering paste designed for precise SMD and BGA operations. The RT‑9 formula provides exceptional wetting, controlled solder flow, and minimal residue, ensuring clean, reliable joints.

• Weight: 10 g – ideal quantity for targeted service use

• No‑Clean formula – eliminates the need for post-soldering cleaning

• Excellent wetting – promotes smooth solder distribution

• Minimal residue – simplifies inspection and maintenance

• Thermally stable – suitable for lead-free soldering processes

• Compatible with hot-air, reflow ovens, and hot-bar soldering equipment

• Soldering and rework of BGA, QFN, QFP, and other fine-pitch SMD components

• Ideal for GSM device repair, computer motherboard fixes, and consumer electronics

• Prototype board assembly and low-volume manufacturing

• Professional-grade service in electronics production and automation industries