RELIFE RL-403B 0,5 mm Tin balls for soldering BGA circuits

RELIFE RL-403B 0.5 mm Solder Balls for BGA Soldering

RELIFE RL-403B Sn63/Pb37 0.5 mm BGA solder balls are a high-quality product designed for precise soldering and repair of devices with high component density, such as mobile phones. Thanks to their excellent quality, these balls are ideal for BGA reballing processes and integrated circuit soldering, ensuring reliable and durable connections.

Product Specifications:

• Model: RELIFE RL-403B
• Composition: Sn63/Pb37 (63% tin, 37% lead)
• Melting temperature: 183°C
• Quantity: 25,000 balls per bottle
• Color: Silver-gray
• Diameter: 0.5 mm
• Application: BGA reballing, integrated circuit soldering

RELIFE RL-403B solder balls feature consistent size and quality, making them an ideal choice for professionals performing precise BGA soldering in electronic devices.