Tin balls for soldering BGA 0,3mm

Tin balls for soldering BGA 0.3mm

The BGA Solder Balls Sn63/Pb37 0.3mm BST-505 are high-quality solder balls designed for precise soldering and repair of devices with high component density, such as mobile phones. Thanks to their excellent quality, the BST-505 solder balls are ideal for BGA reballing and soldering integrated circuits, ensuring reliable and durable connections.

Product Specifications:

• Model: BST-505
• Composition: Sn63/Pb37 (63% tin, 37% lead)
• Melting Temperature: 183 ℃
• Quantity: 25,000 balls per bottle
• Color: Silver-gray
• Diameter: 0.3mm
• Applications: BGA reballing, soldering integrated circuits

The BST-505 solder balls are characterized by their consistent size and quality, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.