Tin balls for soldering BGA 0.76mm

0.76mm Tin Solder Balls for BGA Soldering

These high-quality solder balls are designed for precise soldering and repair of devices with a high component density, such as mobile phones. Due to their excellent quality, they are ideal for the BGA reballing process and soldering integrated circuits, ensuring reliable and durable connections.

Product Specifications:

• Composition: Sn63/Pb37 (63% tin, 37% lead)
• Melting Temperature: 183 ℃
• Color: Silver-gray
• Diameter: 0.76mm
• Applications: BGA reballing, soldering integrated circuits

The solder balls are characterized by their proper size and consistency, making them the perfect choice for professionals involved in precise BGA soldering in electronic devices.