RELIFE RL-400 lead solder paste with a melting point of 183°C - 20g

RELIFE RL-400 lead solder paste with a melting point of 183°C - 20g

Specially developed for the repair of mobile phones, consisting of thousands of tiny nanoparticles.

Designed for soldering SMD components and replacing balls in BGA systems in processes that do not include the washing phase.

After applying the paste to the soldering points, it is enough to heat it with hot air, infrared or convection to a temperature of 183 ° C and it turns into tin.

No washing required after brazing/creep.

The paste should be stored at 0°C - 10°C.

The paste contains a resin-based flux and a solvent.