Lead-free low-temperature solder paste (low-melting point tin) 138°C Mechanic V5B45 - 42g

The lead-free solder paste Mechanic V5B45 is designed for soldering SMD and BGA components. With a low melting point of 138°C, it is perfect for precise electronic applications. The paste features the right viscosity, with no bubbles or solder balls, ensuring solid solder joints. It is recommended for soldering SMD and BGA components on motherboard assemblies for phones, laptops, SMT repair, and other electronic devices. The paste effectively bonds with tin, providing good conductivity and proper tin carrying capacity, minimizing the need for rework after applying solder balls.

Technical specifications:

• Manufacturer: Mechanic
• Product name: V5B45
• Type: Lead-free solder paste
• Melting point: 138°C (low-temperature)
• Packaging volume: 42g
• Composition: Sn42Bi58 (42% tin, 58% bismuth)
• Properties: Good electrical conductivity, easy application, excellent soldering ease
• Use: Designed for industrial soldering of SMD and BGA components
• Storage recommendations: After opening, store at temperatures between 5 to 10°C
• Additional information: If the paste becomes too thick, it can be diluted by adding flux.

This product is ideal for precise and professional use in soldering electronic components.